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0001 0002 #ifndef _HRPPD_ 0003 #define _HRPPD_ 0004 0005 #include <Materials.h> 0006 0007 // -- Overall HRPPD geometry ------------------------------------------------------------------ 0008 // 0009 // A formfactor presently assumed for the final production; 0010 #define _HRPPD_TILE_SIZE_ (120.0*mm) 0011 // Walls ~3mm thick are assumed; 0012 #define _HRPPD_OPEN_AREA_SIZE_ (114.0*mm) 0013 // Area covered by the photocathode in the geometry description; should be a good 0014 // enough description of a fully efficient pixellated anode surface of the real sensors; 0015 // As of 2024/01/28: 108mm -> 104mm, since it is not clear whether Incom can deliver 80% 0016 // OAR (Open Area Ratio) in their final sensor design; stick to 75% (first five EIC HRPPDs); 0017 #define _HRPPD_ACTIVE_AREA_SIZE_ (104.0*mm) 0018 0019 // Stick to 5mm fused silica (first five EIC HRPPDs), since it is not clear whether sapphire 0020 // windows will be used for a final production; 0021 #define _HRPPD_WINDOW_THICKNESS_ (5.0*mm)//(3.8mm) 0022 #define _HRPPD_WINDOW_MATERIAL_ m_FusedSilica//m_Sapphire 0023 0024 // Anode base plate and walls; more or less close to reality; 0025 #define _HRPPD_CERAMIC_BODY_THICKNESS_ (9.0*mm) 0026 #define _HRPPD_BASEPLATE_THICKNESS_ (3.0*mm) 0027 0028 // -------------------------------------------------------------------------------------------- 0029 0030 // Just to fit everything in; 0031 #define _HRPPD_CONTAINER_VOLUME_HEIGHT_ (32.0*mm) 0032 0033 // -- Dead material --------------------------------------------------------------------------- 0034 // 0035 // Assume 100% coverage pure silver plating 15um thick, 4 layers total (pads on both sides 0036 // and ground around signal layer); FIXME: not true for EIC HRPPDs; 0037 #define _HRPPD_PLATING_LAYER_THICKNESS_ (0.06*mm) 0038 0039 // These are some random numbers to the moment; are only important for time-of-flight; 0040 //+#define _HRPPD_METALLIZATION_REFLECTIVITY_ (0.80) 0041 //+#define _HRPPD_METALLIZATION_ROUGHNESS_ (0.05) 0042 0043 // Assume two plates, 600um thick, ~70% OAR as counted for MCP pore coverage; 0044 #define _EFFECTIVE_MCP_THICKNESS_ (2*0.6*mm*0.3) 0045 // FIXME: change to glass; should not really matter I guess; 0046 #define _EFFECTIVE_MCP_MATERIAL_ m_FusedSilica 0047 0048 #define _READOUT_PCB_THICKNESS_ (2.0*mm) 0049 // Want to decrease material budget around the walls; 0050 #define _READOUT_PCB_SIZE_ (_HRPPD_OPEN_AREA_SIZE_ - 2.0*mm) 0051 0052 // This stuff is pretty vague, merely a placeholder; 0053 #define _ASIC_SIZE_XY_ (16.0) 0054 #define _ASIC_THICKNESS_ (1.0) 0055 #define _ASIC_MATERIAL_ m_Silicon 0056 0057 // XY-size is calculated based on the ASIC size and location; 0058 #define _COLD_PLATE_THICKNESS_ (1.5) 0059 #define _COLD_PLATE_MATERIAL_ m_Aluminum 0060 0061 // Water cooling pipe; 0062 #define _COOLING_PIPE_INNER_DIAMETER_ (_INCH_*0.218)//3/8 ) 0063 #define _COOLING_PIPE_WALL_THICKNESS_ (_INCH_*0.016)//1/16) 0064 #define _COOLING_PIPE_MATERIAL_ m_Titanium 0065 0066 // -------------------------------------------------------------------------------------------- 0067 0068 // -- QE and Co ------------------------------------------------------------------------------- 0069 // 0070 #define _USE_HRPPD_24_DATA_ 0071 #ifdef _USE_HRPPD_24_DATA_ 0072 #define _QE_DOWNSCALING_FACTOR_ (30.0/34.3) 0073 #else 0074 #define _QE_DOWNSCALING_FACTOR_ (30.0/37.0) 0075 #endif 0076 0077 // Some reasonably optimistic number; assume that it includes an unknown 0078 // HRPPD Collection Efficiency (CE) as well; 0079 #define _SAFETY_FACTOR_ (0.70) 0080 0081 // This number is 1.00 for HRPPDs (no SiPM-like fill factor or such); keep in place 0082 // for historical reasons; 0083 #define _SENSOR_PLANE_GEOMETRIC_EFFICIENCY_ (1.00) 0084 // -------------------------------------------------------------------------------------------- 0085 0086 #endif
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